Thermal bridging can be a major issue in building construction, causing a reduction in thermal resistance, and heat loss. In turn, this can cause issues like condensation, which could affect surrounding structures, and lead to permanent damage.
Expanded Clay Aggregate (ECA ®) is an ideal material for correcting thermal bridging issues. It’s lightweight enough to be used in just about any building and has an extremely low thermal conductivity coefficient (as low as 0.097 W/mK).
By using ECA ® to fill in areas of your building and correct thermal bridging, you can correct heat loss issues, reduce operating costs for your building, and ensure that moisture and condensation-related problems are avoided.