Thermal bridging can be a major issue in building construction, causing a reduction in thermal resistance, and heat loss. In turn, this can cause issues like condensation, which could affect surrounding structures, and lead to permanent damage.
Expanded Clay Aggregate (ECA) is an ideal material for correcting thermal bridging issues. It’s lightweight enough to be used in just about any building and has an extremely low thermal conductivity coefficient (as low as 0.097 W/mK).
By using ECA to fill in areas of your building and correct thermal bridging, you can correct heat loss issues, reduce operating costs for your building, and ensure that moisture and condensation-related problems are avoided.